TANTALUM NITRIDE Chemical Properties

Melting point:

3360°C

Density 

14.6 g/cm³

solubility 

insoluble in H2O; slightly soluble in aquaregia; reacts with alkaline solutions

form 

Powder

color 

black hexagonal, hexane crystals, crystalline

Resistivity

128–135 (ρ/μΩ.cm)

Water Solubility 

Insoluble in water.

Crystal Structure

Hexagonal

CAS DataBase Reference

12033-62-4(CAS DataBase Reference)

EPA Substance Registry System

Tantalum nitride (TaN) (12033-62-4)

Safety Information

WGK Germany 

3

TSCA 

Yes

MSDS

• Language:English Provider:SigmaAldrich
• Language:English Provider:ALFA

TANTALUM NITRIDE Usage And Synthesis

Chemical Properties

Hexagonal, brown, bronze, or black crystals. Insoluble in water; slightly soluble in aqua regia, nitric acid, hydrogen fluoride.

Physical properties

Bronze or black crystals. Transition temperature 1.8 K. Insoluble in water, slowly attacked by aqua regia, HF, and HNO₃.

Uses

Tantalum nitride is used to create barrier or "glue" layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors and has other electronic applications.

Production Methods

Tantalum nitride, TaN, is produced by direct synthesis of the elements at 1,100 °C (2,012 °F). Very pure TaN has been produced by spontaneous reaction of lithium amide, LiNH2, and TaCl5 . The compound is often added to cermets in 3–18 wt %. Ta3N5 is used as a red pigment in plastics and paints.

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