Trimethoxyphenylsilane
Trimethoxyphenylsilane Basic information
- Product Name:
- Trimethoxyphenylsilane
- Synonyms:
-
- Benzene, (triMethoxysilyl)-
- Trimethoxyphenylsilane >=94%
- Trimethoxyphenylsilane deposition grade, 98%
- A 153
- CP0330
- phenyltrimethoxy-silan
- Silane, phenyltrimethoxy-
- trimethoxyphenyl-silan
- CAS:
- 2996-92-1
- MF:
- C9H14O3Si
- MW:
- 198.29
- EINECS:
- 221-066-9
- Product Categories:
-
- silane
- organosilicon compounds
- Functional Materials
- Si (Classes of Silicon Compounds)
- Silane Coupling Agents
- Silane Coupling Agents (Intermediates)
- Si-O Compounds
- Trialkoxysilanes
- Phenyl Silanes
- Mol File:
- 2996-92-1.mol
Trimethoxyphenylsilane Chemical Properties
- Melting point:
- -25°C
- Boiling point:
- 233 °C(lit.)
- Density
- 1.062 g/mL at 25 °C(lit.)
- vapor pressure
- 0-12790Pa at 20-25℃
- refractive index
- n20/D 1.468(lit.)
- Flash point:
- 99 °F
- storage temp.
- Inert atmosphere,2-8°C
- form
- liquid
- Specific Gravity
- 1.064
- color
- colorless
- Water Solubility
- Reacts with water.
- Hydrolytic Sensitivity
- 7: reacts slowly with moisture/water
- Sensitive
- Moisture Sensitive
- BRN
- 2937896
- LogP
- -0.74-2 at 22℃
- CAS DataBase Reference
- 2996-92-1(CAS DataBase Reference)
- NIST Chemistry Reference
- Silane, trimethoxyphenyl-(2996-92-1)
- EPA Substance Registry System
- Silane, trimethoxyphenyl- (2996-92-1)
Safety Information
- Hazard Codes
- T,Xi,Xn
- Risk Statements
- 10-36/37/38-68/20/21/22-20/21/22-14
- Safety Statements
- 7-16-26-36/37-45-37/39-36
- RIDADR
- UN 1992 3/PG 3
- WGK Germany
- 3
- RTECS
- VV5252000
- F
- 10-21
- TSCA
- Yes
- HazardClass
- 3.2
- PackingGroup
- III
- HS Code
- 29319090
MSDS
- Language:English Provider:SigmaAldrich
- Language:English Provider:ACROS
- Language:English Provider:ALFA
Trimethoxyphenylsilane Usage And Synthesis
Chemical Properties
Colorless transparent liquid
Uses
TMPS can also be used in the preparation of polytrimethoxyphenylsilane (PTMS) that facilitates the removal of graphene after chemical vapor deposition (CVD). Molecularly imprinted sol gels can be synthesized by using TMPS for the fabrication of localized surface plasmon resonance (LSPR).
Uses
An organosilicate compound for nanoelectronics and material science research.
Uses
Phenyltrimethoxysilane is used for nanoelectronics and material science research. It is used as crosslinking agent for silicone resin and to produce polymer organic silicon compound.
General Description
Trimethoxyphenylsilane (TMPS) is an organotrialkoxysilane that is used as a functional monomer in the sol-gel processing.
Flammability and Explosibility
Flammable
Purification Methods
Fractionate it through an efficient column but note that it forms an azeotrope with MeOH which is a likely impurity. [Kantor J Am Chem Soc 75 2712 1953 Beilstein 16 IV 1556.]
Advantages
The polymer molecule generated from phenyltrimethoxysilane contains a rigid hydrophobic group benzene ring and a water-permeable and breathable silica chain. It has surface activity and weather resistance and can be used as an additive in the coating industry, phenyl silica. Introducing chain links can significantly improve thermoelasticity, mechanical properties, and resin adhesion. Therefore, phenyl silicone resin is widely used as high-temperature-resistant electrical insulating paint, high-temperature-resistant coatings, and molding packaging materials.
Trimethoxyphenylsilane Supplier
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Trimethoxyphenylsilane (2996-92-1)Related Product Information
- Trimethoxysilane
- Trimethoxysilylpropanethiol
- Tetraethyl orthosilicate
- Methyltriethoxysilane
- 3-Aminopropyltrimethoxysilane
- Isobutyltrimethoxysilane
- Vinyltrimethoxysilane
- 3-Chloropropyltrimethoxysilane
- Diphenyldiethoxysilane
- Phenyltriethoxysilane
- Trimethoxypropylsilane
- Dodecyltrimethoxysilane
- Triethoxyoctylsilane
- Methyltrimethoxysilane
- SILANE COUPLING AGENT
- Chlorodimethylphenylsilane
- Phenylsilane
- Phenyltris(trimethylsiloxy)silane