1,1,3,3-Tetramethyldisilazane
1,1,3,3-Tetramethyldisilazane Basic information
- Product Name:
- 1,1,3,3-Tetramethyldisilazane
- Synonyms:
-
- Bisdimethylsilylamine
- Disilazane, 1,1,3,3-tetramethyl-
- N-(Dimethylsilyl)(dimethyl)silanamine
- n-(dimethylsilyl)-1,1-dimethyl-silanamin
- N-(dimethylsilyl)-1,1-dimethyl-Silanamine
- Silanamine, N-(dimethylsilyl)-1,1-dimethyl-
- TETRAMETHYLDISILAZANE
- TMDS
- CAS:
- 15933-59-2
- MF:
- C4H15NSi2
- MW:
- 133.34
- EINECS:
- 240-072-2
- Product Categories:
-
- Chemical Synthesis
- Organometallic Reagents
- Analytical Chemistry
- Dimethylsilylation (GC Derivatizing Reagents)
- GC Derivatizing Reagents
- Organosilicon
- Si (Classes of Silicon Compounds)
- Si-H Compounds
- Silazanes
- Silylation (GC Derivatizing Reagents)
- Si-N Compounds
- Mol File:
- 15933-59-2.mol
1,1,3,3-Tetramethyldisilazane Chemical Properties
- Melting point:
- 99-100 °C
- Boiling point:
- 99-100 °C
- Density
- 0.752 g/mL at 25 °C(lit.)
- refractive index
- n20/D 1.404(lit.)
- Flash point:
- 17 °F
- storage temp.
- Store below +30°C.
- solubility
- Miscible with common organic solvents.
- pka
- 9.80±0.70(Predicted)
- form
- clear liquid
- color
- Colorless to Almost colorless
- Specific Gravity
- 0.752
- Hydrolytic Sensitivity
- 7: reacts slowly with moisture/water
- Sensitive
- Moisture Sensitive
- BRN
- 741869
- InChI
- 1S/C4H15NSi2/c1-6(2)5-7(3)4/h5-7H,1-4H3
- InChIKey
- NQCZAYQXPJEPDS-UHFFFAOYSA-N
- SMILES
- [H][Si](C)(C)N[Si]([H])(C)C
- CAS DataBase Reference
- 15933-59-2(CAS DataBase Reference)
- EPA Substance Registry System
- Silanamine, N-(dimethylsilyl)-1,1-dimethyl- (15933-59-2)
Safety Information
- Hazard Codes
- F,Xi
- Risk Statements
- 11-36/37/38
- Safety Statements
- 16-26-36
- RIDADR
- UN 2924 3/PG 2
- WGK Germany
- 3
- F
- 10-21
- TSCA
- TSCA listed
- HazardClass
- 3
- PackingGroup
- II
- HS Code
- 29319090
- Storage Class
- 3 - Flammable liquids
- Hazard Classifications
- Eye Irrit. 2
Flam. Liq. 2
Skin Irrit. 2
STOT SE 3
MSDS
- Language:English Provider:SigmaAldrich
- Language:English Provider:ACROS
- Language:English Provider:ALFA
1,1,3,3-Tetramethyldisilazane Usage And Synthesis
Chemical Properties
Clear colorless to faintly yellow liquid
Physical properties
bp 99–100 °C; n20 D 1.4040; d 0.752 g cm3.
Uses
1,1,3,3-Tetramethyldisilazane is widely used in intramolecular hydrosilation of allyl alcohols, homoallyl alcohols, and homopropargyl alcohols for the regio- and stereoselective synthesis of polyols
Uses
Tetramethyldisilazane is used as a gas chromatographic derivatizing reagent. Further, it reacts with phenol to prepare dimethylphenoxysilane. In addition, it is used in electronic, polymer and pharmaceutical industries.
Properties and Applications
The ICP CVD synthesis of SiCxNy: H thin films using 1,1,3,3-tetramethyldisilazane (TMDSZ ) as a single-source precursor and argon as a gas-activator[1]. Using TMDSZ as the single-source compound produced amorphous hydrogenated silicon carbonitride (a-SiCN: H) films, whereas no such films were formed when HMDSZ was used, which was attributed to the lack of Si–H bond in HMDSZ. Under the collision-free condition, the formation of CH3, NH3, and DMSA was demonstrated from the decomposition of TMDSZ on the heated W filament. Free-radical short-chain reactions dominate the secondary gas-phase reactions of TMDSZ in the reactor setup. The short-chain reaction is initiated by the formation of methyl radicals via the cleavage of the Si–CH3 bonds of TMDSZ. The H abstraction by the produced methyl radicals from the Si–H or the C–H bond in various stable molecules (e.g., TMDSZ) propagates the chain with a resulting radical, which recombines with another radical to terminate the chain reactions, producing a series of products in the high-mass region[2].
References
[1] Maksim N. Chagin. “Synthesis, Properties and Aging of ICP-CVD SiCxNy:H Films Formed from Tetramethyldisilazane.” Coatings (2022).
[2] James Michael Stevenson, Eric Ampong and Yujun Shi*. “Understanding the Reaction Chemistry of 1,1,3,3-Tetramethyldisilazane as a Precursor Gas in a Catalytic Chemical Vapor Deposition Process.” The Journal of Physical Chemistry A 127 44 (2023): 9185–9195.
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