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ChemicalBook >  Product Catalog >  Chemical Reagents >  Silane reagent >  1,1,3,3-Tetramethyldisilazane

1,1,3,3-Tetramethyldisilazane

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1,1,3,3-Tetramethyldisilazane Basic information

Product Name:
1,1,3,3-Tetramethyldisilazane
Synonyms:
  • Bisdimethylsilylamine
  • Disilazane, 1,1,3,3-tetramethyl-
  • N-(Dimethylsilyl)(dimethyl)silanamine
  • n-(dimethylsilyl)-1,1-dimethyl-silanamin
  • N-(dimethylsilyl)-1,1-dimethyl-Silanamine
  • Silanamine, N-(dimethylsilyl)-1,1-dimethyl-
  • TETRAMETHYLDISILAZANE
  • TMDS
CAS:
15933-59-2
MF:
C4H15NSi2
MW:
133.34
EINECS:
240-072-2
Product Categories:
  • Chemical Synthesis
  • Organometallic Reagents
  • Analytical Chemistry
  • Dimethylsilylation (GC Derivatizing Reagents)
  • GC Derivatizing Reagents
  • Organosilicon
  • Si (Classes of Silicon Compounds)
  • Si-H Compounds
  • Silazanes
  • Silylation (GC Derivatizing Reagents)
  • Si-N Compounds
Mol File:
15933-59-2.mol
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1,1,3,3-Tetramethyldisilazane Chemical Properties

Melting point:
99-100 °C
Boiling point:
99-100 °C
Density 
0.752 g/mL at 25 °C(lit.)
refractive index 
n20/D 1.404(lit.)
Flash point:
17 °F
storage temp. 
Store below +30°C.
solubility 
Miscible with common organic solvents.
pka
9.80±0.70(Predicted)
form 
clear liquid
color 
Colorless to Almost colorless
Specific Gravity
0.752
Hydrolytic Sensitivity
7: reacts slowly with moisture/water
Sensitive 
Moisture Sensitive
BRN 
741869
InChI
1S/C4H15NSi2/c1-6(2)5-7(3)4/h5-7H,1-4H3
InChIKey
NQCZAYQXPJEPDS-UHFFFAOYSA-N
SMILES
[H][Si](C)(C)N[Si]([H])(C)C
CAS DataBase Reference
15933-59-2(CAS DataBase Reference)
EPA Substance Registry System
Silanamine, N-(dimethylsilyl)-1,1-dimethyl- (15933-59-2)
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Safety Information

Hazard Codes 
F,Xi
Risk Statements 
11-36/37/38
Safety Statements 
16-26-36
RIDADR 
UN 2924 3/PG 2
WGK Germany 
3
10-21
TSCA 
TSCA listed
HazardClass 
3
PackingGroup 
II
HS Code 
29319090
Storage Class
3 - Flammable liquids
Hazard Classifications
Eye Irrit. 2
Flam. Liq. 2
Skin Irrit. 2
STOT SE 3

MSDS

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1,1,3,3-Tetramethyldisilazane Usage And Synthesis

Chemical Properties

Clear colorless to faintly yellow liquid

Physical properties

bp 99–100 °C; n20 D 1.4040; d 0.752 g cm3.

Uses

1,1,3,3-Tetramethyldisilazane is widely used in intramolecular hydrosilation of allyl alcohols, homoallyl alcohols, and homopropargyl alcohols for the regio- and stereoselective synthesis of polyols

Uses

Tetramethyldisilazane is used as a gas chromatographic derivatizing reagent. Further, it reacts with phenol to prepare dimethylphenoxysilane. In addition, it is used in electronic, polymer and pharmaceutical industries.

Properties and Applications

The ICP CVD synthesis of SiCxNy: H thin films using 1,1,3,3-tetramethyldisilazane (TMDSZ ) as a single-source precursor and argon as a gas-activator[1]. Using TMDSZ as the single-source compound produced amorphous hydrogenated silicon carbonitride (a-SiCN: H) films, whereas no such films were formed when HMDSZ was used, which was attributed to the lack of Si–H bond in HMDSZ. Under the collision-free condition, the formation of CH3, NH3, and DMSA was demonstrated from the decomposition of TMDSZ on the heated W filament. Free-radical short-chain reactions dominate the secondary gas-phase reactions of TMDSZ in the reactor setup. The short-chain reaction is initiated by the formation of methyl radicals via the cleavage of the Si–CH3 bonds of TMDSZ. The H abstraction by the produced methyl radicals from the Si–H or the C–H bond in various stable molecules (e.g., TMDSZ) propagates the chain with a resulting radical, which recombines with another radical to terminate the chain reactions, producing a series of products in the high-mass region[2].

References

[1] Maksim N. Chagin. “Synthesis, Properties and Aging of ICP-CVD SiCxNy:H Films Formed from Tetramethyldisilazane.” Coatings (2022).
[2] James Michael Stevenson, Eric Ampong and Yujun Shi*. “Understanding the Reaction Chemistry of 1,1,3,3-Tetramethyldisilazane as a Precursor Gas in a Catalytic Chemical Vapor Deposition Process.” The Journal of Physical Chemistry A 127 44 (2023): 9185–9195.

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