Xenon tetrafluoride
Uses- Product Name
- Xenon tetrafluoride
- CAS No.
- 13709-61-0
- Chemical Name
- Xenon tetrafluoride
- Synonyms
- XeF4;Difluoroxenon;Tetrafluoroxenon;XENON DIFLUORIDE;XENON(II)FLUORIDE;xenon tetrafluoride;Tetrafluoroxenon(IV);Xenon fluoride (XeF4);Xenon(IV) tetrafluoride;Xenon fluoride (XeF4), (T-4)-
- CBNumber
- CB4731128
- Molecular Formula
- F2Xe
- Formula Weight
- 169.29
- MOL File
- 13709-61-0.mol
Xenon tetrafluoride Property
- Melting point:
- 129 °C(lit.)
- Boiling point:
- 115.73°C (estimate)
- Density
- 4.32 g/mL at 25 °C(lit.)
- vapor pressure
- 3.8 mm Hg ( 25 °C)
- solubility
- reacts with H2O
- form
- colorless monoclinic crystals
- color
- colorless monoclinic crystals, crystalline
- Water Solubility
- reacts violently with H2O, forming Xe, O2, HF, and XeO3 [DOU83]
- InChI
- InChI=1S/F2Xe/c1-3-2
- InChIKey
- IGELFKKMDLGCJO-UHFFFAOYSA-N
- SMILES
- [Xe](F)F
Safety
- Hazard Codes
- O,T+
- Risk Statements
- 8-25-26-34
- Safety Statements
- 17-26-28-36/37/39-45
- RIDADR
- UN 3087 5.1/PG 2
- WGK Germany
- 3
- RTECS
- ZE1294166
- F
- 1-10
- HazardClass
- 5.1
- PackingGroup
- I
N-Bromosuccinimide Price
- Product number
- SC-62262
- Product name
- Xenon difluoride
- Purity
- 95
- Packaging
- 100g
- Price
- $5425
- Updated
- 2021/12/16
- Product number
- SC-62262
- Product name
- Xenon difluoride
- Purity
- 95
- Packaging
- 300g
- Price
- $8925
- Updated
- 2021/12/16
Xenon tetrafluoride Chemical Properties,Usage,Production
Uses
xenon difluoride gas phase etching barrier layer is prepared by the following steps: (1) spraying xenon difluoride gas onto the surface of the exposed barrier layer; (2) irradiating the barrier layer on the upper surface of the dielectric layer with a light beam, so that the etching rate of the barrier layer on the upper surface of the dielectric layer is higher than that of the barrier layer on the sidewalls of the trench and the connecting hole. This invention improves the etching rate of the barrier layer on the upper surface of the dielectric layer by irradiating it with a light beam, making the etching rate of the barrier layer on the upper surface of the dielectric layer higher than that of the barrier layer on the sidewalls of the trench and the connecting hole, thus avoiding over-etching of the barrier layer on the sidewalls of the trench and the connecting hole, improving the microscopic etching uniformity, and achieving better process results.
Chemical Properties
colorless crystal(s); readily prepared by mixing fluorine and xenon; enthalpy of sublimation 60.92 kJ/mol; monoclinic, a=0.5050 nm, b=0.5922nm, c=0.5771 nm [KIR78]
Xenon tetrafluoride Preparation Products And Raw materials
Raw materials
Preparation Products
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