Bis(triethoxysilylpropyl) disulfide
Bis(triethoxysilylpropyl) disulfide Basic information
- Product Name:
- Bis(triethoxysilylpropyl) disulfide
- Synonyms:
-
- BIS(TRIETHOXYSILYLPROPYL)DISULFIDE
- BIS[3-(TRIETHOXYSILYL)PROPYL]-DISULFIDE
- 4,4,13,13-tetraethoxy-3,14-dioxa-8,9-dithia-4,13-disilahexadecane
- 4,4,,-Tetraethoxy-3,-dioxa-8,9-dithia-4,-disilahexadecan
- [Dithiobis(trimethylene)]bis(triethoxysilane)
- A-1589
- Bis[3-(triethoxysilyl)propyl] perdisulfide
- Bis[3-(triethoxysilyl)propyl] persulfide
- CAS:
- 56706-10-6
- MF:
- C18H42O6S2Si2
- MW:
- 474.82
- EINECS:
- 260-350-7
- Product Categories:
-
- silane
- Adhesion Promoters
- Coupling Agents
- Dispersing Agents
- Sulfur Silanes
- Surface Modifiers
- Industrial/Fine Chemicals
- Sulfur
- Mol File:
- 56706-10-6.mol
Bis(triethoxysilylpropyl) disulfide Chemical Properties
- Melting point:
- °C
- Boiling point:
- 250
- Density
- 1.03
- vapor pressure
- 0-7910Pa at 20-25℃
- refractive index
- 1.457
- Flash point:
- 75°C
- storage temp.
- 2-8°C
- Specific Gravity
- 1.03
- Appearance
- Colorless to light yellow Liquid
- Water Solubility
- 14-1000000000μg/L at 20℃
- Hydrolytic Sensitivity
- 7: reacts slowly with moisture/water
- InChI
- InChI=1S/C18H42O6S2Si2/c1-7-19-27(20-8-2,21-9-3)17-13-15-25-26-16-14-18-28(22-10-4,23-11-5)24-12-6/h7-18H2,1-6H3
- InChIKey
- FBBATURSCRIBHN-UHFFFAOYSA-N
- SMILES
- CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC
- LogP
- -3-5.2 at 20℃
- CAS DataBase Reference
- 56706-10-6(CAS DataBase Reference)
- EPA Substance Registry System
- 3,14-Dioxa-8,9-dithia-4,13-disilahexadecane, 4,4,13,13-tetraethoxy- (56706-10-6)
Safety Information
- Risk Statements
- 20/21/22-36/37/38
- Safety Statements
- 26-36/37/39
- TSCA
- Yes
Bis(triethoxysilylpropyl) disulfide Usage And Synthesis
Application
Footwear
- Abrasion resistance
- Cutting and chunking resistance
- Flex life improvement
Rolls
- Abrasion resistance
- Aging resistance
- Processing- Set reduction (better load bearing)
- Reduced water swell
- Lower hysteresis
Mechanical Molded Goods
- Increased modulus
- Better heat aging
- Compression set reduction
- Dynamic property improvement
- Reduced swell to polar liquids
- Filler substitution (non-black for black)
Hose
- Improved abrasion on cover
- Better heat aging
- Increased modulus
- Lower compression set
- Improved adhesion to reinforcing elements
Solid Tires
- Improved abrasion
- Lower hysteresis
- Higher modulus
- Improved processing
- Possibly better adhesion
Tires
- Treads for abrasion, hot tear
- Carcass for adhesion and/or filler substitution
- Breaker (belt) stocks for adhesion
Belts
Flat Belts
- Increased abrasion
- Improved reversion resistance
- Reduced cost with clay substitution for black
- Improved cord adhesion
- Increased flex life and modulus
V Belts
- Increased modulus
- Improved abrasion
- Longer flex life
- Improved adhesion to reinforcing elements
Chemical Properties
Yellowish clear liquid
Flammability and Explosibility
Not classified
Synthesis
5089-70-3
14814-09-6
60764-86-5
56706-10-6
General procedure for the synthesis of (3-mercaptopropyl)triethoxysilane (MPTES), compounds (CAS:60764-86-5) and bis-[3-(triethoxysilyl)propyl]-disulfide (TESPD) from 3-chloropropyltriethoxysilane (CPTES): during the reaction, 50 wt.% NaHSO4 was added drop-wise to a NaHS solution solution. 325 g (2.69 mol) of NaHS solution with 8.2 g (0.0124 mol) of tetrabutylammonium bromide (TBAB) solution were added to a glass reactor, mixed well and heated to 75 °C. Subsequently, NaHSO4 solution was added slowly and dropwise just before the imminent addition. Next, CPTES was added. 497.8 g (2.07 moles) of CPTES was added to the reaction mixture within 8 min. the addition of NaHSO4 solution needed to be completed within 30 min. After 5 hours of reaction, the organic phase was separated and analyzed by gas chromatography (GC). The analysis showed that the product contained 2.0% wt. of CPTES, 87.6% wt. of MPTES, 2.7% wt. of TESPM, and 0.7% wt. of TESPD.Finally, the product was distilled under vacuum to yield MPTES with a purity of 95.4%, which is about 84% yield based on the amount of CPTES used.
References
[1] Patent: US6680398, 2004, B1. Location in patent: Page column 10-11
[2] Patent: US6680398, 2004, B1. Location in patent: Page column 8-9
[3] Patent: US6680398, 2004, B1. Location in patent: Page column 10
[4] Patent: US6680398, 2004, B1. Location in patent: Page column 9-10
[5] Patent: US6680398, 2004, B1. Location in patent: Page column 9
Bis(triethoxysilylpropyl) disulfideSupplier
- Tel
- 15821603031
- karma@hungpai.sina.net
- Tel
- 0371-63336364 17344886665
- 209932355@qq.com
- Tel
- 18210857532; 18210857532
- jkinfo@jkchemical.com
- Tel
- 4006356688 18621169109
- market03@meryer.com
- Tel
- 821-50328103-801 18930552037
- 3bsc@sina.com
Bis(triethoxysilylpropyl) disulfide(56706-10-6)Related Product Information
- POLYAMINOPROPYL BIGUANIDE
- Ethoxyquin
- Phenetidine
- Diallyldisulfide
- DIETHOXYMETHANE
- Ethoxyethyne
- 2-Ethoxyphenol
- acetic acid, triethoxy-, ethyl ester
- Bis(2-methyl-3-furyl)disulfide
- 2-Cyanoethyl N,N,N',N'-tetraisopropylphosphorodiamidite
- 3-Thiocyanatopropyltriethoxysilane
- Bis[3-(triethoxysilyl)propyl]tetrasulfide
- Triethoxysilane
- Propyl disulfide
- 3-Mercaptopropyltriethoxysilane
- Trimethoxysilylpropanethiol
- GGKPDLRPCHPPCHYIPRPKPR
- Bis(triethoxysilylpropyl) disulfide