CURING AGENT (POLYAMIDE BASE LIQUID) FOR EPOXY RES Usage And Synthesis

Description

CURING AGENT (POLYAMIDE-BASED LIQUID) FOR EPOXY RESIN is a substance that reacts chemically with epoxy resin to form a three-dimensional polymer network, encapsulating the reinforcing fibres within this network and facilitating the curing reaction. It is used for the curing, coating, bonding and corrosion protection of epoxy resins in damp environments.

Characteristics

CURING AGENT (POLYAMIDE-BASED LIQUID) FOR EPOXY RESIN is characterised by low toxicity, broad compatibility with epoxy resins, good water resistance, corrosion resistance, flexibility and electrical resistance.

Uses

CURING AGENT (POLYAMIDE-BASED LIQUID) FOR EPOXY RESIN is suitable for waterproof coatings, anti-corrosion coatings, fibreglass anti-corrosion applications, floor coatings, anti-corrosion protection for pipes and equipment, potting compounds, structural adhesives, and more.

CURING AGENT (POLYAMIDE BASE LIQUID) FOR EPOXY RES()Related Product Information

• Plate alignment adhesive
• Frothing adhesive
• Blocked isocyanate crosslinker
• Hardener
• Poly(propylene glycol) bis(2-aminopropyl ether)
• Curing agent for epoxy resin
• Polyamide