Basic information Uses Safety Supplier Related

Xenon tetrafluoride

Basic information Uses Safety Supplier Related

Xenon tetrafluoride Basic information

Product Name:
Xenon tetrafluoride
Synonyms:
  • XENON(II)FLUORIDE
  • XENON DIFLUORIDE
  • XeF4
  • Xenon fluoride (XeF4)
  • Xenon fluoride (XeF4), (T-4)-
  • xenon tetrafluoride
  • XENON DIFLUORIDE, ELECTRONIC GRADE
  • Tetrafluoroxenon
CAS:
13709-61-0
MF:
F2Xe
MW:
169.29
EINECS:
237-260-1
Mol File:
13709-61-0.mol
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Xenon tetrafluoride Chemical Properties

Melting point:
129 °C(lit.)
Boiling point:
115.73°C (estimate)
Density 
4.32 g/mL at 25 °C(lit.)
vapor pressure 
3.8 mm Hg ( 25 °C)
solubility 
reacts with H2O
form 
colorless monoclinic crystals
color 
colorless monoclinic crystals, crystalline
Water Solubility 
reacts violently with H2O, forming Xe, O2, HF, and XeO3 [DOU83]
InChI
InChI=1S/F2Xe/c1-3-2
InChIKey
IGELFKKMDLGCJO-UHFFFAOYSA-N
SMILES
[Xe](F)F
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Safety Information

Hazard Codes 
O,T+
Risk Statements 
8-25-26-34
Safety Statements 
17-26-28-36/37/39-45
RIDADR 
UN 3087 5.1/PG 2
WGK Germany 
3
RTECS 
ZE1294166
1-10
HazardClass 
5.1
PackingGroup 
I

MSDS

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Xenon tetrafluoride Usage And Synthesis

Uses

xenon difluoride gas phase etching barrier layer is prepared by the following steps: (1) spraying xenon difluoride gas onto the surface of the exposed barrier layer; (2) irradiating the barrier layer on the upper surface of the dielectric layer with a light beam, so that the etching rate of the barrier layer on the upper surface of the dielectric layer is higher than that of the barrier layer on the sidewalls of the trench and the connecting hole. This invention improves the etching rate of the barrier layer on the upper surface of the dielectric layer by irradiating it with a light beam, making the etching rate of the barrier layer on the upper surface of the dielectric layer higher than that of the barrier layer on the sidewalls of the trench and the connecting hole, thus avoiding over-etching of the barrier layer on the sidewalls of the trench and the connecting hole, improving the microscopic etching uniformity, and achieving better process results.

Chemical Properties

colorless crystal(s); readily prepared by mixing fluorine and xenon; enthalpy of sublimation 60.92 kJ/mol; monoclinic, a=0.5050 nm, b=0.5922nm, c=0.5771 nm [KIR78]

Xenon tetrafluorideSupplier

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