BUFFER SOLUTION Chemical Properties

Melting point:

300 °C

Density 

1.006 g/mL at 20 °C

vapor density 

4.9 (vs air)

storage temp. 

Inert atmosphere,Room Temperature

solubility 

H₂O: soluble

form 

Liquid

color 

No Color

Exposure limits

ACGIH: TWA 2.5 mg/m3
NIOSH: IDLH 250 mg/m3; TWA 2.5 mg/m3

EPA Substance Registry System

Benzenesulfonic acid, 4,4'-(1,10-phenanthroline-4,7-diyl)bis-, disodium salt (53744-42-6)

Safety Information

Hazard Codes 

Xi,C

Risk Statements 

36/38-36/37/38-36-52/53-35-67

Safety Statements 

26-36-24/25-37/39-61-45-36/37/39

RIDADR 

UN2817

WGK Germany 

3

F 

8-10

HS Code 

2933.99.8210

HazardClass 

8

PackingGroup 

III

MSDS

• Language:English Provider:SigmaAldrich
• Language:English Provider:ACROS
• Language:English Provider:ALFA

BUFFER SOLUTION Usage And Synthesis

Uses

Used for pretreatment of planar silicon devices when plating with Nickel plating solution products 44069 and 44070.

Uses

Use of Buffer HF improved:

• Buffer HF improved dissolves silica films (both thermally grown and silane SiO₂) produced on the surfaces of silicon and exposed by photolithography. It also is capable of dissolving doped silica films such as phosphosilica and borosilica glasses as formed in semiconductor processing. The overall chemical reaction is: 4HF + SiO₂ SiF₄ + 2H₂O
• For trouble-free operation Buffer HF improved is recommended in the new technologies for manufacture of semiconductor planar and mesa devices. It is compatible with both negative and positive photoresists. Excellent results with good reproducibility are simple to achieve without undercutting marked oxides, surface staining or device degradation by metallic impurities.

Uses

Use of Buffer HF improved:

Buffer HF improved dissolves silica films (both thermally grown and silane SiO₂) produced on the surfaces of silicon and exposed by photolithography. It also is capable of dissolving doped silica films such as phosphosilica and borosilica glasses as formed in semiconductor processing.
The overall chemical reaction is: 4HF + SiO₂ SiF₄ + 2H₂O
For trouble-free operation Buffer HF improved is recommended in the new technologies for manufacture of semiconductor planar and mesa devices. It is compatible with both negative and positive photoresists. Excellent results with good reproducibility are simple to achieve without undercutting marked oxides, surface staining or device degradation by metallic impurities.

Definition

ChEBI: Disodium 4,7-diphenyl-1,10-phenanthroline 4',4''-disulfonate is an organic sodium salt having 4,7-diphenyl-1,10-phenanthroline 4',4''-disulfonate as the counterion. It has a role as an iron chelator. It contains a 4,7-diphenyl-1,10-phenanthroline 4',4''-disulfonate.

General Description

Improved HF Buffer System with stabilized HF activity - selective solvent for SiO2 used in semiconductor technology of planar passivated devices - transistors, integrated circuits, diodes, rectifiers, SCR, MOS, FET

Advantages:

• Ready-to-use - Economical
• HF activity buffer stabilized
• Excellent process reproducibility
• Does not undercut masked oxide
• Will not stain diffused silicon surfaces
• Avoids contamination on silicon surfaces
• Photoresist coating unaffected

Buffer HF improved is an idealized buffer preparation characterized by a high buffer index and an optimized, uniform oxide-etch rate. The composition of buffer HF improved is precisely controlled by HF activity measurements and electrometric pH. The mass balance corresponds essentially to (HF) + (F) + 2(HF₂) for a two-ligand mononuclear complex and the charge balance is (H⁺) - (F) + (HF^2- ). The HF activity is maintained constant through the specific equilibrium constant which regulates the equilibrium reaction between fluoride, bifluoride, and HF buffer components. A second equilibrium constant participates in the regulation of the hydronium in concentration of pH.

Buffer HF improved is produced and analyzed to be essentially free of impurities. Nitrate ions, a common impurity causing stains on diffused silicon surfaces, are specifically removed. Heavy metal impurities, which can lead to degradation of device characteristics, are rigidly controlled under manufacturing process specifications.

BUFFER SOLUTION(53744-42-6)Related Product Information

• Magnesium sulfate
• 4-METHYL-1,10-PHENANTHROLINE
• TRIS(BATHOPHENANTHROLINEDISULFONATE)RUTH
• 4-Phenylpyridine
• Pyridinium p-Toluenesulfonate
• 4,7-Dimethyl-1,10-phenanthroline
• Bathophenanthroline
• BUFFER SOLUTION
• 1,10-Phenanthroline hydrate
• PH STANDARD SOLUTION PHTHALATE BUFFER
• BUFFER SOLUTION, PH 10.00 +/-0.02, BLUE,BUFFER SOLUTION, PH 10.00 +/-0.02, COLORLESS, CARBONATE,BUFFER SOLUTION PH 10.00
• BUFFER SOLUTION PH 7.00
• BUFFER SOLUTION PH 5.00,BUFFER SOLUTION PH 5.00
• Buffer solution, pH 4.00 (^+0.01 @ 25^oC), Colored Red, Specpure|r, NIST Traceable
• Buffer solution, pH 1.00 (±0.01 at 25°C), No Color, Specpure, NIST Traceable
• BUFFER SOLUTION, PH 4.63,BUFFER SOLUTION, PH 4.0, ACETATE,BUFFER ACETATE,BUFFER ACETATE, PH 4.00
• Potassium hydrogen phthalate
• Sodium acetate trihydrate