BISPHENOL A DIGLYCIDYL ETHER RESIN Property

Melting point:

64-74 °C

Boiling point:

114-118 °C

Density 

1.18

Tg

100

vapor pressure 

0Pa at 19.85℃

Flash point:

78 °C

storage temp. 

room temp

solubility 

Chloroform (Slightly), DMSO (Soluble), Methanol (Sparingly)

form 

pellets

color 

Gardner: ≤3

Water Solubility 

7mg/L at 25℃

InChIKey

IISBACLAFKSPIT-UHFFFAOYSA-N

LogP

3 at 25℃

EPA Substance Registry System

Bisphenol A epichlorohydrin polymer (25068-38-6)

Safety

Hazard Codes 

Xi,N,Xn,T

Risk Statements 

36/38-43-51/53-42/43-63-62-36/37-20/21/22-45-23/24/25

Safety Statements 

28-37/39-61-36-26-23-45-36/37-53

RIDADR 

UN 3082 9/PG 3

WGK Germany 

2

RTECS 

KC2100000

TSCA 

TSCA listed

Hazard and Precautionary Statements (GHS)

Symbol(GHS)

Signal word

Danger

Hazard statements

H302Harmful if swallowed

H314Causes severe skin burns and eye damage

H315Causes skin irritation

H317May cause an allergic skin reaction

H319Causes serious eye irritation

H350May cause cancer

H411Toxic to aquatic life with long lasting effects

Precautionary statements

P201Obtain special instructions before use.

P273Avoid release to the environment.

P280Wear protective gloves/protective clothing/eye protection/face protection.

P305+P351+P338IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continuerinsing.

P310Immediately call a POISON CENTER or doctor/physician.

P333+P313IF SKIN irritation or rash occurs: Get medical advice/attention.

P337+P313IF eye irritation persists: Get medical advice/attention.

P391Collect spillage. Hazardous to the aquatic environment

BISPHENOL A DIGLYCIDYL ETHER RESIN Chemical Properties,Usage,Production

Introduction

Bisphenol A diglycidyl ether (DGEBA) is a pale yellow liquid epoxy compound formed by the polycondensation of epichlorohydrin (ECH) and bisphenol A (BPA). Bisphenol A diglycidyl ether (DGEBA) can be called a small-molecule adhesive. Epoxy groups located at both ends of the molecule can undergo reactions of ring-opening, cross-linking and solidity with amines, anhydrides, and other curing agents of epoxy resins. Therefore, they are effective adhesion for most substrates such as glass, ceramics, silicon wafers, and polymer materials. It is the lowest molecular weight epoxy resins, and also used as the packaging material for coatings, adhesives, insulating paints, semiconductors, and integrated circuits and other electronic components. In recent years, DGEBA has been used for the inner coating of packaging materials such as canned food.

Preparation

Add bisphenol A and epichlorohydrin in the amount of 1:4 into a three-necked flask equipped with a reflux device, place it in a constant-temperature oil bath, melt it with 70 °C of heat, and dropwise 28.57% aqueous sodium hydroxide solution with a dropping funnel, in which the ratio of the amount of sodium hydroxide and bisphenol A is 4:1. When dropping is completed within half an hour, heat it for 12-24 hours under temperature 70-80°C。 Stop the heating after bisphenol A is completely disappeared validated by TLC method. Cool the mixture to room temperature; add extractant toluene/water (volume ratio 2:1) and stir it at room temperature for half an hour. Transfer to a pear-shaped separatory funnel to separate the liquid, continue washing and separating with deionized water until the solution turns to neutral from alkaline. Distillation and vacuum distillation are used to remove toluene and unreacted epichlorohydrin, respectively. Use a solvent mixture of petroleum ether and ethyl acetate (volume ratio 3:1) a developing solvent to purify it by column chromatography according to the above procedure to obtain DGEBA.




This process, also known as a one-step process, is commonly used for the preparation of low and medium molecular weight bisphenol A epoxy resins.
When the low-molecular-weight bisphenol A epoxy resin is continuously reacted with bisphenol A, the obtained bisphenol A epoxy resin has a high polymerization with a relative molecular mass 1400 or more. This is called a two-step method. When the number-average molecular weight is less than 400, the main component is bisphenol A diglycidyl ether (DGEBA, relative molecular weight 340). To fix the amount of fixed bisphenol A and make excess epichlorohydrin can obtain DGEBA. The reaction process is as follows:


As can be seen from above, the product is bisphenol A diglycidyl ether when there is sufficient epichlorohydrin and enough sodium hydroxide as the catalyst. Excessive amounts of bisphenol A generate linear high molecular compounds with hydroxyl-, etherand epoxy-terminated groups. The internal rotation function of the ether bond increases the flexibility of the molecule, and the hydroxyl group enhances the chemical reactivity and the bonding ability, the epoxy group cross-links molecules into a three-dimensional network structure by reacting with a curing agent. The performance represented by each part of the Bisphenol A-type epoxy resin is shown here:

Uses

Araldite^? 506 epoxy resin has been used as an embedding medium for microscopy.

Uses

PBE can be used as a reinforcing polymer on nanotubes and nanoparticles which can be useful in electronics, optical and aerospace based applications. It can also be used in the formation of solid polymeric electrolyte for potential application in electrochemical devices.

General Description

Poly(Bisphenol-A-co-epichlorohydrin) (PBE) is an epoxy based resin that is a phenoxy polymer derived from bisphenol A and epichlorohydrin.

Solubility in organics

Cellosolve acetate, MEK, THF