Diallyl bisphenol A Chemical Properties

Boiling point:

445.2±40.0 °C(Predicted)

Density 

1.08 g/mL at 25 °C(lit.)

vapor pressure 

0Pa at 20℃

refractive index 

n20/D 1.587(lit.)

Flash point:

>230 °F

storage temp. 

Keep in dark place,Sealed in dry,Room Temperature

pka

10.53±0.10(Predicted)

Water Solubility 

31.1mg/L at 20℃

InChIKey

WOCGGVRGNIEDSZ-UHFFFAOYSA-N

LogP

4.12 at 20℃

CAS DataBase Reference

1745-89-7(CAS DataBase Reference)

EPA Substance Registry System

Phenol, 4,4'-(1-methylethylidene)bis[2-(2-propenyl)- (1745-89-7)

Safety Information

Hazard Codes 

C

Risk Statements 

34-43

Safety Statements 

23-26-27-36/37/39-45

RIDADR 

UN 1760 8/PG 3

WGK Germany 

3

HazardClass 

8

PackingGroup 

III

MSDS

• Language:English Provider:2,2'-Diallylbisphenol A
• Language:English Provider:SigmaAldrich

Diallyl bisphenol A Usage And Synthesis

Appearance

Diallyl bisphenol A is light yellow or brown liquid

application

It is mainly used for the modification of Bismaleimide (BMI), which can greatly reduce the application cost of BMI resin and improve the handling and processability of BMI resin. Improve the toughness, heat resistance and moldability of BMI resin. Can be used for:
1. electrical insulation materials, copper clad circuit boards, high temperature impregnating varnish, insulating varnish laminates, molded plastics, etc.
2. wear-resistant materials, diamond grinding wheel, heavy-duty grinding wheel, brake pads, high temperature bearing adhesives, etc.
3. aerospace structural materials.
4. functional materials. Anti-aging agent for rubber, adding 1-3% BBA to rubber can greatly improve the anti-aging process of rubber.

Storage Condition

Keep in a cool, dry, dark location in a tightly sealed container or cylinder. Keep away from incompatible materials, ignition sources and untrained individuals. Secure and label area. Protect containers/cylinders from physical damage.

Uses

diallyl bisphenol A is a kind of modified monomer of thermosetting resin which is mainly used in the modifying and toughening of bismaleimide resin, epoxy resin, phenolic resin etc., and it can enhance the toughness of thermosetting resin greatly. It also can be used as actively diluent of thermosetting resin. The adhesion strength between metal can be further improved when used in rubber.

General Description

2,2′-Diallylbisphenol A (DABA) is a diallyl based epoxy modification agent that blends with the resin to improve the mechanical property of the epoxy material. It is majorly used in novalac based resins, which can be further cured with bismaleimides (BMI) for aerospace, electronics and wireless communication based applications.

Diallyl bisphenol A(1745-89-7)Related Product Information

• Sodium allylsulfonate
• 3-Aminophenol
• N,N'-Methylenebisacrylamide
• N,N-Dimethylallylamine
• Methacrylamide
• Diallylamine
• Phenol
• Phenol Red
• N-Methylolacrylamide
• Methacryloyl chloride
• Allyl bromide
• Allyl glycidyl ether
• Bisphenol A
• 2-METHYL-2-PROPENE-1-SULFONIC ACID SODIUM SALT
• 4,4'-DIHYDROXYDIPHENYLMETHANE
• Diallyldisulfide
• 2,2-Bis(4-hydroxy-3-methylphenyl)propane
• 2-Butanone